99.95% Polished Tungsten Plates For Semiconductor Electronics
1. The following is a description of 99.5% polished tungsten plates for semiconductor electronics.
Tungsten plate is a material with high melting point and low thermal expansion coefficient in high temperature environment.
The surface of the polished tungsten plate is steel gray or silver white, with high hardness, high melting point, low thermal expansion coefficient, and is not eroded by air at room temperature. Tungsten plate has special properties, such as low thermal expansion and good thermal conductivity, sufficient resistance to electrical resistance, and high elastic modulus. Therefore, tungsten plates are widely used in various fields. Such as the manufacture of tungsten sputtering targets, semiconductor electronic parts, tungsten boats, heat shields and heating elements of high temperature furnaces, electric light source parts and electric vacuum devices, ion implantation parts, etc.
Purity:99.95%
Density:19.3 g/cm3
Standard: ASTM B760
Flatness: ≤2%
2. Size Of 99.95% Polished Tungsten Plates For Semiconductor Electronics:
| Thickness(mm) | Width(mm) | Length (mm) | Surface |
| 3-10 | 150±1.0 | 1000±2.0 | polished |
| 10-20 | 150±1.0 | 800±2.0 | polished |
| 20-30 | 150±1.0 | 700±2.0 | polished
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Also can supply other size of tungsten sheet:
| Thickness(mm) | Width(mm) | Length(mm) | Surface |
| 0.1±0.01 | 150±0.2 | 1200±2.0 | cold rolled |
| 0.2±0.02 | 150±1.0 | 1200±2.0 | cold rolled |
| 0.3±0.02 | 400±1.0 | 1200±2.0 | cold rolled |
| 0.4±0.04 | 450±1.0 | 1200±2.0 | cold rolled |
| 0.5±0.04 | 450±1.0 | 1200±2.0 | cold rolled |
| 0.8±0.08 | 450±1.0 | 1200±2.0 | cold rolled |
| 1.0±0.06 | 450±1.0 | 1200±2.0 | alkaline washing |
| 1.5±0.08 | 450±1.0 | 1200±2.0 | alkaline washing |
| 2.0±0.10 | 450±1.0 | 1200±2.0 | alkaline washing |
| 3.0±0.10 | 450±1.0 | 1200±2.0 | alkaline washing |
3. Application Of 99.95% Polished Tungsten Plates For Semiconductor Electronics:
1). Tungsten molybdenum heat shield
2). Vacuum furnace support frame, carrier plate, plate heater
3). Targets for vacuum coating
4). Tungsten parts for physical vapor deposition
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