Molybdenum discs are used in the semiconductor industry as contact materials
1. Description of Molybdenum Disc Used For Semiconductor Industry:
Molybdenum discs are frequently utilized as contact materials in GTOs, transistors, and silicon-controlled rectifier diodes. Now, because of its very low cost and light weight, molybdenum is the material of choice for mounting power semiconductor devices except for some special uses. Both materials, silicon and molybdenum, have the same coefficient of expansion and both have high thermal conductivity, making them ideal choices, especially for large-area power devices that generate a lot of heat. More applications include molybdenum as a heat sink base for semiconductor component products, large-scale integrated circuits, and hybrid circuits.
2. Size of Molybdenum Disc Used For Semiconductor Industry:
Mo disc
Dia.(10-500mm) x thickness(0.1-40)mm
Density:10.2g/cm3
Purity:99.95%
meterial:Mo1,TZM,Mo-La
Surface: black,C.C,bright,polished
Standard: ASTMB 386 or ASTM B387
As requested by the buyer, other sizes can be produced.
Below are some sizes for reference:
| Thickness | Diameter |
| mm | inch | mm | inch |
| 0.1 - 0.3 | 0.004 - 0.012 | 1.0 - 50.0 | 0.040 - 2.0 |
| 0.31 - 0.5 | 0.012 - 0.020 | 1.0 - 50.0 | 0.040 - 2.0 |
| 0.51 - 1.0 | 0.020 - 0.040 | 2.0 - 80.0 | 0.080 - 3.2 |
| 1.1 - 2.0 | 0.040 - 0.080 | 10.0 - 130.0 | 0.40 - 5.2 |
| 2.1 - 3.0 | 0.080 - 0.120 | 20.0 - 130.0 | 0.80 - 5.2 |
| 3.1 - 4.0 | 0.120 - 0.160 | 40.0 - 100.0 | 1.60 - 4.0 |
| 4.1 - 6.0 | 0.160 - 0.240 | 50.0 - 90.0 | 2.0 - 3.6 |
3. Features of Molybdenum Disc Used For Semiconductor Industry:
Molybdenum has a high melting point.
Low coefficient of thermal expansion.
High thermal conductivity.
Low resistivity.
High hardness.
Other Related Products For Semiconductor Industry:
W/Mo end plate Mo foil W/Mo plate W/Mo boat
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