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Custom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum Metal

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Custom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum Metal

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Brand Name : PRM

Model Number : custom

Certification : ISO9001

Place of Origin : China

MOQ : 1kg

Price : $50~150/kg

Payment Terms : T/T

Supply Ability : 2000kgs/month

Delivery Time : 7~10 work days

Packaging Details : Plywood case

Name : Molybdenum Sheet For Semiconductor

Material : Molybdenum and Molybdenum alloy

Grade : Mo1,TZM,MoLa alloy

Density : 10.2g/cm3

Shape : round sheet

Application : semiconductors

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Molybdenum Sheet For Semiconductor

1. Description Of Molybdenum Sheet For Semiconductor:

High purity, high density, fine, and uniform grain characteristics are present in molybdenum sputtering targets, resulting in extremely high sputtering efficiency, uniform film thickness, and a smooth etching surface during the sputtering process.

Molybdenum sheet for semiconductors has excellent mechanical properties, low expansion, high thermal conductivity, and extremely high electrical conductivity at high temperatures. It is a refractory metal with a variety of uses.

There are many different combinations of molybdenum that can be used as a sputtering target, including pure molybdenum, molybdenum titanium, molybdenum tantalum, and molybdenum alloy targets. High purity, high density, fine, and consistent grain properties are present in molybdenum sputtering targets, resulting in extremely high sputtering efficiency, homogeneous film thickness, and a clean etching surface throughout the sputtering process. Molybdenum sheet made to a customer's specifications for semiconductors.

2. Parameter Of Molybdenum Sheet For Semiconductor:

Name Molybdenum Sheet For Semiconductor
Molecular Weight 95.94
Appearance Silvery
Melting Point 2623 °C
Boiling Point 4639 °C
Density 10280 kg/m3
Solubility in H2O N/A
Electrical Resistivity 5.2 microhm-cm @ 0 °C
Electronegativity 1.9 Paulings
Heat of Fusion 6.6 Cal/gm mole
Heat of Vaporization 128 K-Cal/gm atom at 4612 °C
Poisson's Ratio 0.31
Specific Heat 0.0599 Cal/g/K @ 25 °C
Tensile Strength N/A
Thermal Conductivity 1.38 W/cm/K @ 298.2 K
Thermal Expansion (25 °C) 4.8 µm·m-1·K-1
Vickers Hardness 1530 MPa
Young's Modulus 329 GPa

3. Products Show Of Molybdenum Sheet For Semiconductor:

Custom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum MetalCustom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum Metal


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Custom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum Metal

Custom Molybdenum TZM Sheets For Semiconductor Molybdenum Disc Moly Sheet TZM Molybdenum Alloy Molybdenum Metal


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Molybdenum TZM Sheets

      

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